| Function | Frequency (Min-Max) | Input Voltage | Current | RON | COFF | Isolation | Switching Speed | IDD | Lifetime | Controller | Packaging | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MM1200 | 6xSPST | DC–1GHz | 150 V | 1 A | 0.5 Ω | 10 fF | 10 GΩ | <10 µs | < 1 µA | >3B cycles | Parallel | 6 x 6 mm BGA |
The MM1200 is intended for high-density signal switching applications in both AC and DC circuits and meant to replace electromechanical signal relays or reed relays. The core technology has found commercial uses in demanding applications such as medical equipment and test & measurement equipment.
The MM1200 is capable of 1.0 A per channel steady state. The MM1200 will deliver low on-state contact resistance and high off-state isolation with >3 billion switching cycles and <10µs switching times.
Each switch is Normally Open (NO) and individually controlled by a Serial Peripheral Interface (SPI) bus. An external +5 VDC logic supply and high voltage +75 VDC bias source is required for operation of the internal switch driver.
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Bottom view
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85% PCB area reduction and 75% build height reduction together with lower weight enables new form factors for relay and switch matrix boards.
 | EM Signal Relay | Key Benefits | |
|---|---|---|---|
| Space & Weight | MM1200 | Relays, Driver, Capacitors and Power Supplies | • 85% PCB area reduction • 75% Build height reduction • 120 g weight savings/100 DPDT |
| Switching Speed | 10 µs | 3 ms | • 300x switching speed improvement enables faster measurements |
| Reliable Performance | Mechanical: <3B Operations | Mechanical: 10M Operations | • 30x reliability reduces system downtime |
| Control | Serial bus programs all circuits (daisy-chain) with shared high voltage supply | One signal line/one/driver per coil + power supply for drivers | • Digital control direct from MCU • Simplifies schematic & routing on PCB |
| Power Consumption | No hold power | 100 relays have >10 W of hold power (need to drive coil) | • Saves 10-20 W power consumption per 100 relays • Reduced cooling requirements enables new form factors |
