Menlo Micro has reinvented one of the most fundamental building blocks of electronic systems – the electronic switch. Menlo Micro’s technology creates a new switch category that eliminates compromises and tradeoffs by combining the benefits of electromechanical and solid-state switches into the best of both worlds with its “Ideal Switch.”
Are you interested in playing a critical, impactful role and work with top electronic systems talent at an exciting startup backed by industry leaders? Do you want to help create truly disruptive and unique products that have the ability to change markets? If you answered yes to both, this may be your opportunity to have a significant impact at a cutting-edge startup with industry-leading technology that will drive electronic systems innovation across a diverse range of industries.
You will be part of the New Technology Introduction (NTI) team and have responsibilities for technology development that span across multiple product platforms. The core of this role with be on thermal and mechanical structure simulation for MEMS ohmic switch device, switch device in package and switch product in the final application system. In this role you will be a core member of the New Technology Introduction Team (NTI) that is responsible for support developing and characterizing new ohmic MEMS switch device designs and architectures aligned with Menlo’s product performance roadmap and its Metal MEMS process. You will report to the Technology Director and work within a fast paced and energetic Technology team.
You will work in an innovative team environment supporting the Technology team with goal to develop robust solutions for evolving MEMS switch devices capable of both a broad frequency range (DC to 67GHz) and wide power/current handling capability (10A~20A DC/AC and 25Watt RF/Microwave). This requires a deep and broad knowledge on mechanics, materials and FEA analysis. You will work closely with layout, process and test development engineers to ensure design solution alignment. You will also work closely with early adopting customers to ensure upfront spec alignment and system integration success. This responsibility of this role is support MEMS device development, leading MEMS package development and application support in terms of mechanical structure analysis, stress analysis and thermal analysis.