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MEMS Thermal and Structure Simulation Engineer

Albany, New York
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About Us

Menlo Micro has reinvented one of the most fundamental building blocks of electronic systems – the electronic switch. Menlo Micro’s technology creates a new switch category that eliminates compromises and tradeoffs by combining the benefits of electromechanical and solid-state switches into the best of both worlds with its “Ideal Switch.”

Are you interested in playing a critical, impactful role and work with top electronic systems talent at an exciting startup backed by industry leaders? Do you want to help create truly disruptive and unique products that have the ability to change markets? If you answered yes to both, this may be your opportunity to have a significant impact at a cutting-edge startup with industry-leading technology that will drive electronic systems innovation across a diverse range of industries.

Role Summary and Purpose

You will be part of the New Technology Introduction (NTI) team and have responsibilities for technology development that span across multiple product platforms.  The core of this role with be on thermal and mechanical structure simulation for MEMS ohmic switch device, switch device in package and switch product in the final application system. In this role you will be a core member of the New Technology Introduction Team (NTI) that is responsible for support developing and characterizing new ohmic MEMS switch device designs and architectures aligned with Menlo’s product performance roadmap and its Metal MEMS process. You will report to the Technology Director and work within a fast paced and energetic Technology team.

You will work in an innovative team environment supporting the Technology team with goal to develop robust solutions for evolving MEMS switch devices capable of both a broad frequency range (DC to 67GHz) and wide power/current handling capability (10A~20A DC/AC and 25Watt RF/Microwave). This requires a deep and broad knowledge on mechanics, materials and FEA analysis. You will work closely with layout, process and test development engineers to ensure design solution alignment.  You will also work closely with early adopting customers to ensure upfront spec alignment and system integration success.  This responsibility of this role is support MEMS device development, leading MEMS package development and application support in terms of mechanical structure analysis, stress analysis and thermal analysis.

You will: 

  • Be responsible for MEMS switch device structural and thermal multi-physics FEA modeling to design and optimize device architecture, validate design performance to meet performance and reliability specs
  • Be responsible for switch device package structural, stress and thermal multi-physics FEA modeling to design and optimize package design, validate design performance to meet performance and reliability specs
  • Provide design solutions to improve MEMS device structure and thermal performance
  • Provide design solutions to improve MEMS device package stress and thermal performance
  • Work with NTI team members to develop and validate new technologies and design rules
  • Document validated design elements, modeling setup and validation procedures
  • Generate core design and technology intellectual property
  • Support reliability and performance validation
  • Support of new product integration and validation
  • Support MEMS switch product customer qualification and field issue analysis
  • Work with customers who are early adopters to new technology, new device and new system architecture to simulate and validate innovative design concepts
  • Comply with all company quality and safety policies and procedures

Qualifications and Requirements

  • MS or PhD in STEM related disciplines (Science, Technology, Engineering, Math)
  • Proven experience in mechanical design and simulation
  • Proven experience with 3D modeling and FEA
  • Proven experience on thermal and mechanical design principles, mechanical materials and thermal properties
  • Strong problems solving skills through experimental design and data analysis
  • Excellent verbal and written communication skills
  • Ability to work in a multi-disciplinary team environment
  • Excellent communication skills
  • Legal authorization to work in the U.S. is required
  • Travel up to 10% of time 
  • Work office located in Albany, NY, and potential for remote

Desired Characteristics

  • PhD is preferred
  • ANSYS, SolidWorks/Abaqus, and COMSOL experience preferred
  • Knowledge of MEMS or Semiconductor device fabrication and/or packaging
  • Knowledge of package technologies
  • Knowledge of MEMS device mechanical characterization
  • Professional work experience in industry is preferred
  • Good organization skills with the ability to handle multiple tasks and set priorities to meet goals in a fast-paced environment
  • A desire to be a critical problem solver and innovator
  • Demonstrated ability to investigate, find root cause, and correct actions of device failures
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