High-Speed Path (HS) allows for full compliance at speed testing with DUT loopback
Med-Speed Path (MS) allows for scan and digital patterns sourced from ATE.
Low-Speed Path (LS) allows for full DC parametric testing from ATE
There is no need for dual-insertion testing.
All critical routing is built in with AC coupling caps, drastically simplifying layout for PCB designers, and easing SI challenges at high-speeds.
Function | Frequency | Insertion Loss | Switch Speed | Lifetime | Controller | VBB or VIN VDD | Packaging | |
---|---|---|---|---|---|---|---|---|
MM5620 | 2x DP3T | DC-20 GHz 64 Gbps | 1.5 dB @ 16 GHz | <30 µs | >3B cycles | SPI/GPIO | 5 V 3.3 V | 8.2 x 8.2 mm LGA |
MM5622 | 2x DP3T | DC-20 GHz 64 Gbps | 1.1 dB @ 16 GHz | <30 µs | >3B cycles | SPI/GPIO | 5 V 3.3 V | 8.2 x 8.2 mm LGA |
The MM5620 is a high-speed differential loopback switch (AC coupled) supporting the high-speed differential signal switching required in PCIe Gen 6, SerDes and other applications. The MM5620 is based on Menlo’s Ideal Switch® technology and can operate up to 64 Gbps or 20 GHz for high-performance applications.
The MM5620 has low insertion loss, fast switching speed, and can operate with greater than 3 billion switching cycles. The MM5620’s integrated charge pump and driver can be controlled through SPI or GPIO interfaces by a host processor.
Access additional design information on the
Menlo Support Portal >
Top View
Top View
Bottom View
Bottom View
PAM4 Eye Diagram
• DC to 20 GHz range
• Differential Dual DP3T switch with Loopback
• Normally Open, Reflective actuator
• Low Insertion Loss: -1.5 dB @ 16 GHz
• Integrated charge pump and driver eliminates the requirement for external biasing and driver circuitry
• Built-in AC Coupling Capacitors
• Fully controllable ports for low, medium, and high data rate signal routing
• High Reliability: >3 Billion switching operations
• 8.2 x 8.2 mm LGA Package
• Automated Test Equipment
• Measurement Equipment
• Semiconductor Final Package Test
• Compliance and Loopback Test
• High-Speed Data Digital Component Testing
• Optical-Electrical Module Testing
• High-Speed Signal Routing
• ATE Device Interface Boards
• Optical-Electrical Module Testing
• Differential Switch Matrices
MM5620 | EM (SMT) SPDT | Key Benefits | |
---|---|---|---|
Market | High-speed digital & RF DIB/PIB market | High-speed digital & RF DIB/PIB market | |
Configuration | DP3T DC-20 GHz/64 Gbps | SPDT 18 GHz/40 Gbps | Dual DP3T with built-in loopback capacitor |
Power Consumption | < 10 mW | 200 mW | 95% reduction in power consumption |
Reliability | >3B operations | 3M operations | 1000x increase in lifetime: reduced down-time, maintenance and cost |
Switching Time | <30 µs | 5 ms operation time | x165 speed increase: reduced test time and cost-to-test |
Size/Chip Density | 141.2 mm3 8.2 x 8.2 x 2.1 mm LGA | 1103.3 mm3 SMT 11x8.5(d) x 11.8 (h) | 85% volume reduction: enables more parallel tests, easier routing (top and/or bottom) |
The MM5622 is a high-speed differential loopback switch (DC coupled) supporting the high-speed differential signal switching required in the latest PCIe Gen 5, Gen 6, SerDes, and other standards. The MM5622 is based on Menlo’s Ideal Switch® technology and can operate at 64 Gbps with a bandwidth of 20 GHz for high-performance applications.
The MM5622 has low insertion loss, fast switching speed, and can operate with greater than 3 billion switching cycles. The MM5622 system-in-package (SiP) solution fully integrates the switch driver and charge pump controlled through SPI or GPIO interfaces by a host processor. In addition, integrated decoupling capacitors provide significant board footprint reduction for high-volume production test solutions.
Access additional design information on the
Menlo Support Portal >
Top View
Top View
Bottom View
Bottom View
• DC to 20 GHz range
• Differential Dual DP3T switch with Loopback
• Normally Open, Reflective actuator
• Low Insertion Loss: -1.1 dB @ 16 GHz
• Integrated charge pump and driver eliminates the requirement for external biasing and driver circuitry
• Fully controllable ports for low, medium, and high data rate signal routing
• High Reliability: >3 Billion switching operations
• 8.2 x 8.2 mm LGA Package
• Automated Test Equipment
• Measurement Equipment
• Semiconductor Final Package Test
• Compliance and Loopback Test
• High-Speed Data Digital Component Testing
• Optical-Electrical Module Testing
• High-Speed Signal Routing
• ATE Device Interface Boards
• Optical-Electrical Module Testing
• Differential Switch Matrices
MM5622 | EM (SMT) SPDT | Key Benefits | |
---|---|---|---|
Market | High-speed digital & RF DIB/PIB market | High-speed digital & RF DIB/PIB market | |
Configuration | DP3T DC-20 GHz/64 Gbps | SPDT 18 GHz/40 Gbps | Dual DP3T with built-in decoupling capacitor |
Power Consumption | < 10 mW | 200 mW | 95% reduction in power consumption |
Reliability | >3B operations | 3M operations | 1000x increase in lifetime: reduced down-time, maintenance and cost |
Switching Time | <30 µs | 5 ms operation time | x165 speed increase: reduced test time and cost-to-test |
Size/Chip Density | 141.2 mm3 8.2 x 8.2 x 2.1 mm LGA | 1103.3 mm3 SMT 11x8.5(d) x 11.8 (h) | 85% volume reduction: enables more parallel tests, easier routing (top and/or bottom) |