Menlo Micro, Corning Demonstrates World’s First Through Glass Via (TGV) Package for MEMS Switch Applications

Brings Significant Benefits in Size, Cost and Performance

PHILADELPHIA, June 12, 2018 – A new era of high-performance RF and power switching products has begun. Corning Incorporated and Menlo Micro, the company responsible for re-inventing one of the most fundamental building blocks of electronic systems – the electronic switch – today announced a major milestone in the development of Menlo’srevolutionary Digital-Micro-Switch (DMS) technology platform. The two companies have demonstrated the successful integration of Through Glass Via (TGV) packaging technology, enabling the expansion of Menlo’s high-performance RF and power products to ultra-small wafer scale packaging.

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