Press Release

Menlo Micro, Corning Demonstrates World’s First Through Glass Via (TGV) Package for MEMS Switch Applications

June 12, 2018

Brings Significant Benefits in Size, Cost and Performance

PHILADELPHIA, June 12, 2018 – A new era of high-performance RF and power switching products has begun. Corning Incorporated and Menlo Micro, the company responsible for re-inventing one of the most fundamental building blocks of electronic systems – the electronic switch – today announced a major milestone in the development of Menlo’srevolutionary Digital-Micro-Switch (DMS) technology platform. The two companies have demonstrated the successful integration of Through Glass Via (TGV) packaging technology, enabling the expansion of Menlo’s high-performance RF and power products to ultra-small wafer scale packaging.

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