Senior Bond Process Engineer

About Us

Menlo Micro has reinvented one of the most fundamental building blocks of electronic systems – the electronic switch. Menlo Micro’s technology creates a new switch category that eliminates compromises and tradeoffs by combining the benefits of electromechanical and solid-state switches into the best of both worlds with its “Ideal Switch.”

Are you interested in playing a critical, impactful role and work with top electronic systems talent at an exciting startup backed by industry leaders? Do you want to help create truly disruptive and unique products that have the ability to change markets? If you answered yes to both, this may be your opportunity to have a significant impact at a cutting-edge startup with industry-leading technology that will drive electronic systems innovation across a diverse range of industries.

Role Summary and Purpose

You will be an integral member of the team responsible for driving Menlo’s process technologies into high volume manufacturing. The core aspect of this role will be to establish the wafer bonding tools, processes, procedures and manufacturing fundamentals to bring a dedicated volume fab online for Menlo’s MEMS based Ideal Switch fabrication.

You will report to the Senior Director of Process Integration/Engineering and work within a fast paced and energetic team as well as work cross functionally with the Operations, Quality and other teams.

Essential Responsibilities

This position is responsible for wafer bonding of 200mm fused silica wafers.   The successful candidate will provide strategic wafer bond process leadership and execution for identification, specification, selection, site preparation, process establishment & qualification and product and site qualification for the wafer bonding equipment in Menlo’s MEMS based fabrication line. 

A thorough understanding of wafer bonding equipment, material properties as well as surface preparation is required. The candidate will drive Menlo’s processes and process development into qualified volume manufacturing.

You will:

• Lead all wafer bond process and process transitions from tool selection to development into volume production
• Be responsible for driving the identification, specification, purchase and installation requirements for all wafer bonding equipment and associated metrology tools
• Manage the wafer bonding tool selection and installation process
• Document and ensure compliance with safety requirements for all phases of tool installation and operation.
• Manage tool process demonstration and sign-off criteria, including the preparation and execution of equipment test plans and data collection.  Test plans should include sample size, wafer-to-wafer & lot-to-lot repeatability, etc., while data collection could include defect counts, uniformity, etc.
• Establish process of record (POR) for wafer bonding conditions for multiple product lines within a dedicated MEMS volume production fabrication facility
• Work jointly with the New Technology Introduction (NTI) and Operations teams in all aspects of tool and process establishment
• Establish routine process monitoring including Statistical Process Control (SPC) charts to ensure process repeatability and demonstrate process capability
• Establish and maintain Standard Operating Procedures (SOPs) for all equipment and associated metrology in your area of responsibility
• Train operators and/or technicians to properly load, unload, select process recipes and understand both hardware and software functionality of your equipment.
• Establish and train safety procedures for operation and maintenance of the tools.
• Ensure and maintain quality standards, engineering requirements and product specifications for Menlo’s process technology
• Comply with all company quality and safety policies and procedures

Qualifications and Requirements

• BS, MS or PhD in STEM (Science, Technology, Engineering, Math) related disciplines such as Chemical Engineering, Chemistry, Material Science, Physics, Optics, Electrical Engineering, etc.
• Strong background in semiconductor or electronic device materials and physics
• Minimum 7 years of industrial or relevant experience in microelectronics
• Minimum 5 years cleanroom fabrication including bonding experience
• In depth understanding of semiconductor tools, processes and volume manufacturing
• Demonstrated ability leading engineering teams toward successful project completion
• Demonstrated ability to work with external partners to drive tool identification, selection and installation
• Ability to define meaningful experiments and analyze data
• Excellent technical and trouble-shooting skills
• Ability to work in a multi-disciplinary team environment
• Willingness to travel about 10% of time 
• Excellent verbal and written communication skills
• Good organization skills with the ability to handle multiple tasks and set priorities to meet goals in a fast-paced environment
• Legal authorization to work in the U.S. is required
• Able to work out of an office & fab located in Ithaca, NY

Desired Characteristics

• Multiple years of experience in wafer bond process ownership
• Experience communicating complex material, process, test results to broadly skilled audience
• Prior history with demonstrated critical problem solving and innovation methodologies
• Knowledge of ohmic MEMS switch device fabrication
• Demonstrated ability to investigate, find root cause, and implement corrective actions of device failures
• Experience working with NTI & NPI teams on early integration of fabrication processes