Menlo Micro has reinvented one of the most fundamental building blocks of electronic systems – the electronic switch. Menlo Micro’s technology creates a new switch category that eliminates compromises and tradeoffs by combining the benefits of electromechanical and solid-state switches into the best of both worlds with its “Ideal Switch.”
Are you interested in playing a critical, impactful role and work with top electronic systems talent at an exciting startup backed by industry leaders? Do you want to help create truly disruptive and unique products that have the ability to change markets? If you answered yes to both, this may be your opportunity to have a significant impact at a cutting-edge startup with industry-leading technology that will drive electronic systems innovation across a diverse range of industries.
You will be an integral member of the team responsible for driving Menlo’s process technologies into high volume manufacturing. The core aspect of this role will be to establish the wafer bonding tools, processes, procedures and manufacturing fundamentals to bring a dedicated volume fab online for Menlo’s MEMS based Ideal Switch fabrication.
You will report to the Senior Director of Process Integration/Engineering and work within a fast paced and energetic team as well as work cross functionally with the Operations, Quality and other teams.
This position is responsible for wafer bonding of 200mm fused silica wafers. The successful candidate will provide strategic wafer bond process leadership and execution for identification, specification, selection, site preparation, process establishment & qualification and product and site qualification for the wafer bonding equipment in Menlo’s MEMS based fabrication line.
A thorough understanding of wafer bonding equipment, material properties as well as surface preparation is required. The candidate will drive Menlo’s processes and process development into qualified volume manufacturing.