Senior Electroplating Process Engineer

About Us

Menlo Micro has reinvented one of the most fundamental building blocks of electronic systems – the electronic switch. Menlo Micro’s technology creates a new switch category that eliminates compromises and tradeoffs by combining the benefits of electromechanical and solid-state switches into the best of both worlds with its “Ideal Switch.”

Are you interested in playing a critical, impactful role and work with top electronic systems talent at an exciting startup backed by industry leaders? Do you want to help create truly disruptive and unique products that have the ability to change markets? If you answered yes to both, this may be your opportunity to have a significant impact at a cutting-edge startup with industry-leading technology that will drive electronic systems innovation across a diverse range of industries.

Role Summary and Purpose

You will be an integral member of the MEMS Process Engineering team responsible for driving Menlo’s process technologies into high volume manufacturing. The core aspect of this role will be to establish the Electroplating and Wet Process fabrication processes, chemistry analysis and characterization techniques, specify tools, maintain tool procedures and manufacturing fundamentals to establish and maintain a MEMS wafer-based volume manufacturing line.

You will report to the Senior Director of Process Integration/Engineering and work within a fast paced and energetic team as well as work cross functionally with the Operations, Quality and other teams.

Essential Responsibilities

This position is responsible for both direct site and support of foundry for all Electroplating (MEMS, Via, Interconnect) and Wet Chemistry etch processes including Process controls, Tools, Chemical Analysis and Process Development, throughout Menlo’s multi-site manufacturing landscape.  This position requires thorough understanding of typical semiconductor and MEMS chemistries, thin film characteristics and ability to optimize properties through the execution of Design of Experiments (DOEs). 

This role is responsible for driving Menlo’s processes and process development into qualified volume manufacturing.

You will:

• Lead all Electroplating and Wet Chemistry Etch process engineering from development through volume production.
• Be responsible for driving the identification, specification, purchase and installation requirements for all wet chemistry tools, process equipment and associated metrology tools.
• Establish the chemical analysis tools and methodologies for maintaining and improving the manufacturing processes.
• Establish process of record (POR) for multiple electroplating and wet etch tools across multiple product lines within a dedicated MEMS volume production fabrication facility.
• Work jointly with New Technology Introduction (NTI) and Operations teams in all aspects of tool and process establishment.
• Manage tool process demonstration along with tool sign-off criteria, including the preparation and execution of equipment test plans and data collection; test plan definitions to include such things as sample size, wafer-to-wafer repeatability, lot-to-lot repeatability, etc.; data collection could include such items as film resistivity measurements, film uniformity, defect counts, stress measurements, etc.
• Establish routine process monitoring with such things as Statistical Process Control (SPC) charts to ensure process repeatability and demonstrate process capability.
• Establish and maintain Standard Operating Procedures (SOPs) for process equipment and associated metrology.
• Train operators and/or technicians to properly load, unload, select process recipes and understand both hardware and software functionality of equipment in your area of responsibility.
• Ensure and maintain quality standards, engineering requirements and product specifications for Menlo’s process technology.
• Comply with all company quality and safety policies and procedures.

Qualifications and Requirements

• MS or PhD in STEM (Science, Technology, Engineering, Math) related disciplines such as Physics, Optics, Material Science, Electrical Engineering, Chemical Engineering, Chemistry, etc.
• Strong theoretical and working knowledge of electrochemistry
• Strong background in analytical and analysis techniques for chemistry maintenance and development
• Demonstrated experience running characterization tools and developing techniques for (SEM, EDS, FIB, Auger, SIMS, XPS, etc.)
• Working knowledge of semiconductor or electronic device materials and physics.
• Working knowledge of semiconductor tools, processes and volume manufacturing.
• Minimum 7 years of industrial or relevant experience in microelectronics.
• Minimum 5 years cleanroom fabrication experience including electroplating experience.
• Demonstrated ability to work with external partners to drive tool identification, selection and installation.
• Ability to define meaningful experiments and analyze data.
• Ability to work in a multi-disciplinary team environment.
• Excellent verbal and written communication skills.
• Good organizational skills with the ability to handle multiple tasks and set priorities to meet goals in a fast-paced environment.
• Able to work full-time in office located in Ithaca, NY
• Willingness to travel about 10% of time. 
• Legal authorization to work in the U.S. is required.

Desired Characteristics

• Experience in electroplating processes including TSVs, TGVs, and Copper Pillars
• Demonstrated expertise plating semiconductor/MEMS microstructures where stress control, elemental composition control, high aspect ratio plating uniformity are controlled through plating process parameters
• Fundamental understanding of electrochemistry, wet chemical metal and insulator etches, and plating chemistry composition.
• Working knowledge of all MEMS or semiconductor fabrication processing.
• Experience communicating complex material, process, test results to broadly skilled audience.
• A desire to be a critical problem solver and innovator.
• Demonstrated ability to investigate, find root cause, and implement corrective actions of device failures.
• Experience working with NTI and NPI teams on early integration of fabrication processes
• Experience with AMAT Raider, ClassOne Soltice, Semsysco Triton wafer based electroplating platforms