Watch the animation

BEAM
• Proprietary alloys
• High temperature capable
• Decades of life

CONTACT
• Low resistance
• Billions of operations
• No stiction

GATE
• Electrostatic = low power
• No charging

FROM UNIT CELL TO CELL ARRAY
Simple cell design makes it very small – 50μm x 50μm – and easy to pack in dozens or hundreds of switches on a die.

SCALABLE PRODUCTS
Configurable in series and/or parallel designs to create an infinite number of product configurations.

THROUGH-GLASS-VIA
PACKAGING

Packaging hermetically sealed in a miniaturized chip-scale package for superior RF performance.

Made like a semiconductor.
We take the best-practices used to manufacture billions of semiconductor devices every year and leverage them to make the Ideal Switch.

SCALABLE MANUFACTURING
Simple 14-layer process and 8” wafers enables high-volume and low-cost manufacturing.

VERSATILITY
World’s first standardized Process Design Kit for a MEMS switch. Shorter design cycles and faster time-to-market for new products.

HOW IT WORKS

Meet the
Ideal Switch.

Every material and every part of the Ideal Switch “Unit-Cell” is optimized for its specific job.

BEAM
• Proprietary alloys
• High temperature capable
• Decades of life

CONTACT
• Low resistance
• Billions of operations
• No stiction

GATE
• Electrostatic = low power
• No charging

FROM UNIT CELL TO CELL ARRAY
Simple cell design makes it very small – 50μm x 50μm – and easy to pack in dozens or hundreds of switches on a die.

SCALABLE PRODUCTS
Configurable in series and/or parallel designs to create an infinite number of product configurations.

THROUGH-GLASS-VIA
PACKAGING

Packaging hermetically sealed in a miniaturized chip-scale package for superior RF performance.

Made like a semiconductor.
We take the best-practices used to manufacture billions of semiconductor devices every year and leverage them to make the Ideal Switch.

SCALABLE MANUFACTURING
Simple 14-layer process and 8” wafers enables high-volume and low-cost manufacturing.

VERSATILITY
World’s first standardized Process Design Kit for a MEMS switch. Shorter design cycles and faster time-to-market for new products.

BEAM
• Proprietary alloys
• High temperature capable
• Decades of life

CONTACT
• Low resistance
• Billions of operations
• No stiction

GATE
• Electrostatic = low power
• No charging

FROM UNIT CELL TO CELL ARRAY
Simple cell design makes it very small – 50μm x 50μm – and easy to pack in dozens or hundreds of switches on a die.

SCALABLE PRODUCTS
Configurable in series and/or parallel designs to create an infinite number of product configurations.

THROUGH-GLASS-VIA
PACKAGING

Packaging hermetically sealed in a miniaturized chip-scale package for superior RF performance.

Made like a semiconductor.
We take the best-practices used to manufacture billions of semiconductor devices every year and leverage them to make the Ideal Switch.

SCALABLE MANUFACTURING
Simple 14-layer process and 8” wafers enables high-volume and low-cost manufacturing.

VERSATILITY
World’s first standardized Process Design Kit for a MEMS switch. Shorter design cycles and faster time-to-market for new products.

Beneath the glass.

Combining semiconductor manufacturing with a micro-mechanical actuator, the Ideal Switch air-gap achieves practically infinite isolation when OFF, and close to Zero Ω when ON. This combination creates the unique properties of the Ideal Switch:
Carries AC/DC and RF
Linear performance from DC to > 50 GHz
Switches at <10μs
Performs reliably >3 Billion times
Negligible resistance eliminates the need for bulky, heavy heatsinks
Transistor

Application-specific configurations

Core Switch
Simplest, smallest building block for power or RF applications.
Switch with Integrated Controls
Integrated controllers for high channel counts reduce need for external components.
Switch-based Subsystems
Multiple switch die with additional functionality for higher-level switching subsystems.
RF System-on-Glass
Integrate passives and other structures directly on glass to create miniaturized RF subsystems.
“It looks like the 200 year-old electromechanical relay will be the next casualty of MEMS technology.”

KURT PETERSEN
ENTREPRENEUR, IEEE LIFE FELLOW,
“Mr. MEMS”

To get your own EVK, get in touch. We have sales teams around the world.
Compare Ideal Switch performance to EM relays and SS switches.