Package Design Engineer

Irvine, CA

About Us:

Menlo Micro has reinvented one of the most fundamental building blocks of electronic systems – the electronic switch. Menlo Micro’s technology creates a new switch category that eliminates compromises and tradeoffs by combining the benefits of electromechanical and solid-state switches into the best of both worlds with its “Ideal Switch.”

Are you interested in playing a critical, impactful role and work with top electronic systems talent at an exciting startup backed by industry leaders? Do you want to help create truly disruptive and unique products that have the ability to change markets? If you answered yes to both, this may be your opportunity to have a significant impact at a cutting-edge startup with industry-leading technology that will drive electronic systems innovation across a diverse range of industries.

Role Summary & Purpose:

  • Explore the primary responsibilities of this role.
  • Reporting to the Director of Operations, as Package Design Engineer, you will leverage your knowledge of semiconductor packaging technology to support new product introductions and ongoing projects. You will be responsible for package design including:
  • Interfacing between Design, Product Development, Operations Teams and OSAT (Outsourced Semiconductor Assembly and Test) foundry
  • Supporting New Product Introduction activities (NPI) through phase gate  

Your specific duties will include:

  • Working with the design team to define the package requirements
  • Reviewing and approving package outline drawings, substrate drawings, and BOMs
  • Creating and maintaining procedures to oversee NPI and Operations programs
  • Establishing and maintaining regular program updates and status reporting
  • Developing and implementing processes with Design team to ensure design-for-manufacturing elements are included as an integral element of the new product definition effort.
  • Working with OSAT in new and improving assembly process, running process DOE’s, identifying new materials and equipment, reliability testing, and qualification of new assembly process.

Qualifications & Requirements:

  • To meet the basic qualification for this role, you will have legal authorization to work permanently in the United States for any employer. In addition, to be a good fit for the Package Design Engineer opportunity, you will have:
  • Bachelor’s degree in Engineering  
  • Minimum 5 years’ experience in semiconductor packaging technology
  • Knowledge of various assembly processes: WLCSP, Flip Chip, SIP and organic laminate technologies
  • Experience in AutoCad, and Thermal and Mechanical modelling (to read, correct and share with the design team) 
  • A background in material science or chemistry preferred
  • Strong interpersonal communication skills with the ability to work effectively with multiple levels, titles and teams

*This role is located in Irvine, California. Relocation assistance may be available to an outstanding candidate. 

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