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PCB Design and MEMS Layout Engineer

Irvine, CA
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About Us

Menlo Micro has reinvented one of the most fundamental building blocks of electronic systems – the electronic switch. Menlo Micro’s technology creates a new switch category that eliminates compromises and tradeoffs by combining the benefits of electromechanical and solid-state switches into the best of both worlds with its “Ideal Switch.”

Are you interested in playing a critical, impactful role and work with top electronic systems talent at an exciting startup backed by industry leaders? Do you want to help create truly disruptive and unique products that have the ability to change markets? If you answered yes to both, this may be your opportunity to have a significant impact at a cutting-edge startup with industry-leading technology that will drive electronic systems innovation across a diverse range of industries.

Role Summary and Purpose

You will be responsible for RF, Power, MEMS device, package, and board layout to support the engineering development and production of Menlo’s ohmic switch technology. In this role you will be a core member of the New Product Introduction Team (NPI) that is responsible for developing components and application circuits based on Menlo’s ohmic MEMS switch design.  You will also support the New Technology Introduction Team (NTI) in MEMS device layout, and fabrication process technology nodes development. You will report to the SVP of the Menlo NPI team.

Essential Responsibilities:

You will use Altium for PCB design and L-Edit for MEMS layout.  You will work in an innovative team environment supporting the Technology team goal to deliver a robust RF MEMS device PDK capable of both a broad frequency range (DC to 60GHz) and power handling up to 50dBm for both device and microsystem solutions.  You will work closely with MEMS design, process, and test development engineers to effectively translate design and test requirements into robust device, wafer, and package layouts.  You will develop and maintain robust design rule validation scripts for layout and tape out verification. In this hands-on role, you will be responsible for the delivery of device and package to support design, simulation, fab tape-out and assembly activities for horizontal RF MEMS technology and product development.  You will work in a fast paced and adaptive team environment that is developing innovative technology with impact on broad industrial and commercial products.

You will: 

  • Administer and support Altium PCB design tools.
  • Create template documents and template projects with proper DFM rules settings in compliance with company processes.
  • Create and maintain companywide integrated PCB libraries for Altium.
  • Provide schematic/layout support to other Altium users.
  • Maintain companywide Altium designs repository.
  • Perform schematic driven PCB component placement and layout ensuring best DFM practices.
  • Generate assembly and fabrication drawings.
  • Review PCB layout and documentation of other engineers prior to quote request.
  • Submit PCB quote requests and manage follow up interactions with approved vendors to ensure timely completion of boards fabrication and assembly.
  • Deliver MEMS device, package and PC board layouts to support the engineering design, development and production of RF MEMS and digital microswitch technology.
  • Develop design rules to verify layout compliance with device fabrication, package and board build-up
  • Maintain, update and improve design rules for microswitch technology.
  • Work closely with wafer fabrication and package assembly partners to ensure seamless and valid tapeout.
  • Work closely with design and process engineers to develop new device and process architectures.
  • Work with Technology and Product teams to develop new technologies for DMS products.
  • Work closely with product team to transition new design rules, maintain design rules and support product development.
  • Drive sound experimental methodologies to develop and maintain robust layout design rules and scripts.
  • Comply with all company quality and safety policies and procedures.

Qualifications and requirements:

  • BS in engineering with minimum 5 years of professional work experience in MEMS or semiconductor device layout.
  • Demonstrated understanding of wafer based fab manufacturing tape out
  • Experience in MEMS or Semiconductor device fabrication and/or packaging
  • Demonstrated understanding of RF devices and their layout
  • Capability to execute script based layout methodologies
  • Experience is establishing, maintaining and running design rule verification for mask tape out
  • Demonstrate proficiency with L-Edit or similar layout and design software
  • Ability to work in a multi-disciplinary team environment
  • Willingness to travel <10% of time 
  • Excellent communication skills.
  • Legal authorization to work in the U.S. is required
  • Must be willing to work out of an office located in Irvine, CA
  • Must be 18 years or older

Desired Characteristics

  • Industrial experience in MEMS or semiconductor device layout and tapeout.
  • A desire to be a critical problem solver and innovator.
  • Experience using sound DOE methodologies to solve problems.
  • Experience performing electrical tests and measurements to verify device design and layout.
  • Experience with Altium for package and PCB board layout.
  • Experience with MEMS and/or semiconductor device test and characterization
  • Experience with RF package and PCB board technologies
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