Senior Advanced Packaging Engineer

About Us

Menlo Micro has reinvented one of the most fundamental building blocks of electronic systems – the electronic switch. Menlo Micro’s technology creates a new switch category that eliminates compromises and tradeoffs by combining the benefits of electromechanical and solid-state switches into the best of both worlds with its “Ideal Switch.”

Are you interested in playing a critical, impactful role and work with top electronic systems talent at an exciting startup backed by industry leaders? Do you want to help create truly disruptive and unique products that will change markets? If you answered yes to both, this may be your opportunity to have a significant impact at a cutting-edge startup with industry-leading technology that will drive electronic systems innovation across a diverse range of industries.

Role Summary and Purpose

You will drive the thermal-mechanical design, new package and assembly process development and production package optimization for Menlo Micro’s diverse power and RF products that use our innovative MEMS switch technology. In this role you will be the lead engineer ensuring technical attainment of all design and qualification requirements, including characterization and reliability testing, and participate in the timely release-to-production. 

You will directly impact critical roadmaps and support new technology developments. Projects will encompass design, characterization, packaging, thermal / mechanical considerations, assembly, mechanical test strategy, data analysis, reliability testing, root cause problem solving, and material dispositioning.

Essential Responsibilities

This is a hands-on role, and key responsibilities include: 

• Device substrate, package, and module design & Design for Manufacturability (DFM) of MEMS-based RF and power switch products
• Effective material, process and component design and selection based on thorough thermal, mechanical and stress analysis
• Mechanical design and simulation of microelectronic packages and assemblies
• Package technology roadmap definition and execution for modules and packaging aspects of Menlo Micro’s product lines
• Assessment and integration of 3D Heterogeneous packaging strategy
• 3D modeling for Menlo Micro packages, modules and assemblies
• Characterization and reliability stress testing of both die, package and module-level products 
• Design verification of Coefficient of Thermal Expansion (CTE) thermal impedance, and associated stresses
• Material selection for mechanical parts and attachments
• Solder stress modeling on packages and modules
• Timely qualification and production launches
• Data analysis, dispositions, and associated reports
• Development and deployment of comprehensive design verification test capabilities that ensure compliance to spec.
• Work with the technology team to enhance and validate new technologies, device structures, and design rules
• Work with the test development team to drive pre-production yield enhancements, reliability and test methodology improvements
• Provide feedback into next generation product specifications and development

Qualifications and Requirements

• Deep and thorough understanding of microsystem package design, characterization, qualification and reliability requirements
• Experience with power module development through product manufacturing deployment
• Demonstrated ability to drive thorough new package verification and validation procedures
• Demonstrated sound DOE practices
• Demonstrated ability to investigate, find root cause, and implement appropriate corrective actions using statistical data analysis methods across a broad range of disciplines including device physics, fabrication, test methods, product specifications and product reliability
• Strong working knowledge of statistical data analysis tools and scripting languages
• Work directly and interactively with multidisciplinary engineering team and customers to define and implement effective package and module product solutions
• Ability to design and simulate effective thermal solutions for products
• BS, MS or PhD in mechanical engineering, physics, or electrical engineering with a minimum 5 years of experience 
• Ability to work in a multi-disciplinary team environment
• Willingness to travel up to 10% of the time
• Must be US person per ITAR regulations
• Desired work location is Albany, NY or Irvine, CA

Desired Characteristics

• Experience with advanced packaging technologies
• Experience in aerospace and defense industry
• Experience with heat pipes, liquid cooling and other advanced thermal management technologies for power electronics
• A critical problem solver and innovator
• Expertise in SolidWorks software
• Subject matter expertise in CFD analysis
• Excellent communication skills
• Experience with power package technologies
• Familiarity with power relays and protection devices
• Provide mentorship to junior mechanical engineers
• Experience with AC and DC power systems at ratings up to 1kV and 1000A
• A working understanding of MEMS or semiconductor device design and fabrication.

Salary

DOE